108 / 2 |
Phase stabilities and interfacial reactions of the Cu–In binary systems
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#07.可負擔的潔淨能源 #08.尊嚴就業與經濟發展 #09.產業創新與基礎設施
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2022-08-08 |
109 / 1 |
Phase Characterization of Interfacial Reactions in the Ni/In/Cu Ternary System
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#07.可負擔的潔淨能源 #08.尊嚴就業與經濟發展 #09.產業創新與基礎設施
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2022-08-08 |
110 / 2 |
Improved stability and film formability of oil-based silver nanoparticle suspensions by addition of polystyrene
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#08.尊嚴就業與經濟發展 #09.產業創新與基礎設施
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2023-07-14 |
110 / 1 |
Effects of surface diffusion and solder volume on porous-type Cu3Sn in Cu/ Sn/Cu microjoints
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#07.可負擔的潔淨能源 #08.尊嚴就業與經濟發展 #09.產業創新與基礎設施
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2022-08-23 |
110 / 2 |
Solid–liquid interdiffusion bonding of Cu/In/Ni microjoints
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#07.可負擔的潔淨能源 #08.尊嚴就業與經濟發展 #09.產業創新與基礎設施
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2023-07-14 |
111 / 2 |
Partial Segregation of Bi and Microvoid Formation on a Pure Cu Substrate After Solid–Solid Reactions
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#07.可負擔的潔淨能源 #08.尊嚴就業與經濟發展 #09.產業創新與基礎設施
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2024-07-16 |
112 / 1 |
Microstructural observation of Bi67In reacting with Cu for microelectronic interconnects
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#07.可負擔的潔淨能源 #08.尊嚴就業與經濟發展 #09.產業創新與基礎設施
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2024-07-16 |
112 / 1 |
Study on the growth mechanisms of Cu‑In compounds at the Sn52In/Cu interface
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#07.可負擔的潔淨能源 #08.尊嚴就業與經濟發展 #09.產業創新與基礎設施
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2024-07-16 |
112 / 2 |
Microstructural evaluation of interfacial intermetallic compounds between Sn58Bi and ENEPIG
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#07.可負擔的潔淨能源 #08.尊嚴就業與經濟發展 #09.產業創新與基礎設施
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2024-05-27 |
112 / 2 |
Enhancing the Permeate Flux Improvement of Direct Contact Membrane Distillation Modules with Inserted S-Ribs Carbon-Fiber Filaments
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2024-05-30 |