期刊論文
| 學年 | 110 |
|---|---|
| 學期 | 1 |
| 出版（發表）日期 | 2021-08-01 |
| 作品名稱 | Instrumentation of Twin-MCMs based Mutual-Test |
| 作品名稱（其他語言） | |
| 著者 | Wang, S.S.P.; Y.T. Wang; C.-L. Chao; W.-B. Yang |
| 單位 | |
| 出版者 | |
| 著錄名稱、卷期、頁數 | Microelectronics Journal 114, 105108 |
| 摘要 | This paper presents advanced data collection methods using boundary scan based vector analysis, developed to debug manufacturing defects on cell based IC's such as JTAG compliant dice. Advantageously, they provide solutions to unknown dice by arranging identically designed Multi-chip Modules (MCM), to thereby diagnose possible flaws on dice due to thermal stresses on substrates as well as cold or hot soldering of the bumps, of which introducing fatigue and cracks, etc., defectives, and this system potentially to repair the problematic MCMs after trouble-shooting the twin-MCMs through self and mutual testing to validate the Known Good Dice (KGD). |
| 關鍵字 | Multi-chip module;Chiplet;Interposer;Substrate;Know-good-die;Flip-chip;Boundary scan;JTAG;Wafer scale integration |
| 語言 | en |
| ISSN | 0026-2692 |
| 期刊性質 | 國外 |
| 收錄於 | SCI EI |
| 產學合作 | |
| 通訊作者 | |
| 審稿制度 | 否 |
| 國別 | USA |
| 公開徵稿 | |
| 出版型式 | ,電子版 |
| 相關連結 |
機構典藏連結 ( http://tkuir.lib.tku.edu.tw:8080/dspace/handle/987654321/121778 ) |