Microstructural Evolution of Low-Temperature Solder Joints
學年 110
學期 1
發表日期 2021-11-13
作品名稱 Microstructural Evolution of Low-Temperature Solder Joints
作品名稱（其他語言）
著者 T.T. Tseng; G.W. Wu; H.T. Liang; Y.W. Wang
作品所屬單位
出版者
會議名稱 2021 Materials Research Society-Taiwan International Conference (2021 MRSTIC)
會議地點 台北市，台灣(線上會議)
摘要 Lead-free solder development is critical for semiconductor package. The properties of solder determine the process temperature and joint strength. SnAgCu and SnAg are the leading lead-free solder. However, the melting point is about 220oC, which is higher than former SnPb melting point. It is urgent to find low-temperature lead-free solder. The benefits of reducing process temperature include protection of device damage and energy-saving. Low carbon footprint reduces greenhouse effect that is friendly to environment. In this study, we choose Sn, Bi, and In elements as low-temperature solder candidates. Bi or In addition can reduce the melting point. In addition, In has good ductile and anti-corrosion. Observation of microstructure between low-temperature solder and Cu during solid-liquid and solid-solid reactions in this study. Reducing the process temperature is important for temperature-sensitive devices in order to avoid thermal damage. The composition of intermetallic compounds, phase transformation and mechanical properties are main objectives in this study.
關鍵字 low-temperature solder;microstructure;temperature-sensitive devices
語言 en_US
收錄於
會議性質 國際
校內研討會地點 無
研討會時間 20211113~20211117
通訊作者 Y.W.Wang (王儀雯)
國別 TWN
公開徵稿
出版型式
出處 中國材料科學學會國際會議暨年會
相關連結

機構典藏連結 ( http://tkuir.lib.tku.edu.tw:8080/dspace/handle/987654321/122551 )

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