Instrumentation of Twin-MCMs based Mutual-Test
學年 110
學期 1
出版（發表）日期 2021-08-01
作品名稱 Instrumentation of Twin-MCMs based Mutual-Test
作品名稱（其他語言）
著者 Wang, S.S.P.; Y.T. Wang; C.-L. Chao; W.-B. Yang
單位
出版者
著錄名稱、卷期、頁數 Microelectronics Journal 114, 105108
摘要 This paper presents advanced data collection methods using boundary scan based vector analysis, developed to debug manufacturing defects on cell based IC's such as JTAG compliant dice. Advantageously, they provide solutions to unknown dice by arranging identically designed Multi-chip Modules (MCM), to thereby diagnose possible flaws on dice due to thermal stresses on substrates as well as cold or hot soldering of the bumps, of which introducing fatigue and cracks, etc., defectives, and this system potentially to repair the problematic MCMs after trouble-shooting the twin-MCMs through self and mutual testing to validate the Known Good Dice (KGD).
關鍵字 Multi-chip module;Chiplet;Interposer;Substrate;Know-good-die;Flip-chip;Boundary scan;JTAG;Wafer scale integration
語言 en
ISSN 0026-2692
期刊性質 國外
收錄於 SCI EI
產學合作
通訊作者
審稿制度 否
國別 USA
公開徵稿
出版型式 ,電子版
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