Efficient due-date quoting and production scheduling for integrated circuit packaging with reentrant processes
學年 107
學期 1
出版（發表）日期 2018-08-01
作品名稱 Efficient due-date quoting and production scheduling for integrated circuit packaging with reentrant processes
作品名稱（其他語言）
著者 L. Y. Hsieh; C.-B. Cheng
單位
出版者
著錄名稱、卷期、頁數 IEEE Transactions on Components, Packaging and Manufacturing Technology 8(8), p.1487-1495
摘要 The advances in packaging technology in the past decade have overcome a few engineering limitations in integrated circuit (IC) manufacturing. This has greatly complicated the manufacturing process and created a huge challenge in the operations management of the semiconductor back-end production. In particular, the modern demand of lighter and smaller products expedites the multichip packaging technology, which requires reentrant processes and hence makes resource scheduling more difficult. Apart from the fact that IC packaging shares many key features with the semiconductor front-end production, the cycle time of back-end production is significantly shorter than that of the front-end production. Therefore, there is an urgent need of a rapid solution procedure to generate a reliable production schedule for IC packaging. To respond to customer requests efficiently, this paper models the production scheduling of IC packaging as an optimization model and formulates a hybrid genetic algorithm (GA) to solve the problem efficiently. The embedded structure of our model enables the decomposition of the original problems into many small-sized subproblems, which can be solved by available optimization solvers. These subproblems communicate via a master problem, which is solved by a GA to determine the due dates assigned to subproblems. The master and the subproblems are iteratively solved in turn to obtain a satisfactory solution. Computational experiments and an empirical study are performed to validate the efficiency and the feasibility of the proposed approach.
關鍵字 Job shop scheduling;Integrated circuits;Integrated circuit packaging;Optimization;Genetic algorithms;Packaging
語言 en
ISSN 2156-3950; 2156-3985
期刊性質 國外
收錄於 SCI
產學合作
通訊作者 Chi-Bin Cheng
審稿制度 否
國別 TWN
公開徵稿
出版型式 ,電子版,紙本
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