Numerical simulation and experimental study on physical mechanism in multiple component moulding
學年 104
學期 1
出版（發表）日期 2016-01-15
作品名稱 Numerical simulation and experimental study on physical mechanism in multiple component moulding
作品名稱（其他語言）
著者 Chao-Tsai Huang; Che-Ping Lin; Shih-Po Sun; Shi-Chang Tseng; Rong-Yeu Chang
單位
出版者
著錄名稱、卷期、頁數 International Journal of Materials and Product Technology 52(1-2), p.118-142
摘要 Multiple component moulding (MCM) is one of the great methods to fabricate the modern injection products. Due to many procedure combinations, it is very difficult to know the detailed process. Besides, because of its complicated nature and the unclear physical mechanism, using trial-and-error method cannot realize and manage the mechanism effectively. In this study, we will review various MCM technologies, including over-moulding, and co-injection moulding, and study these two applications in more details. Results show that the product geometries, process condition, and moulded materials will affect the product quality. The physical mechanism of warpage in a sequential over-moulded part is due to the unbalance between the volumetric shrinkage during filling/packing and the thermal unbalance from cooling. The warpage behavior for co-injection moulding is more complicated because of the uncertain interface. However, one of the keys to manage the warpage is the control of the core penetration.
關鍵字 multiple component moulding;MCM;over-moulding;co-injection moulding;warpage
語言 en
ISSN 0268-1900; 1741-5209
期刊性質 國外
收錄於 SCI EI
產學合作
通訊作者 黃招財
審稿制度 是
國別 CHE
公開徵稿
出版型式 ,電子版,紙本
相關連結

機構典藏連結 ( http://tkuir.lib.tku.edu.tw:8080/dspace/handle/987654321/106121 )