會議論文
| 學年 | 93 |
|---|---|
| 學期 | 2 |
| 發表日期 | 2005-03-15 |
| 作品名稱 | Flat plate loop heat pipe with a novel evaporator structure |
| 作品名稱（其他語言） | |
| 著者 | Tsai, Meng-chang; Yu, Chun-sheng; Kang, Shung-wen |
| 作品所屬單位 | 淡江大學機械與機電工程學系 |
| 出版者 | Piscataway: Institute of electrical and electronics engineers (IEEE) |
| 會議名稱 | Semiconductor Thermal Measurement and Management Symposium, 2005 IEEE Twenty First Annual IEEE |
| 會議地點 | San Jose, CA, USA |
| 摘要 | The paper proposes the fabrication and test of flat plate loop heat pipe (FPLHP) with a novel evaporator structure. The IC industry of Taiwan, ROC is one of the most competitive industries in the world. With the increase in electric heat dissipation and miniaturization, we need advanced cooling systems to solve the high temperature problems. We describe the evaporator design and a new stretched design. Finally, the test results show that the new design of FPLHP works very well. |
| 關鍵字 | |
| 語言 | en |
| 收錄於 | |
| 會議性質 | 國際 |
| 校內研討會地點 | |
| 研討會時間 | 20050315~20050317 |
| 通訊作者 | |
| 國別 | USA |
| 公開徵稿 | Y |
| 出版型式 | |
| 出處 | Semiconductor Thermal Measurement and Management Symposium, 2005 IEEE Twenty First Annual IEEE, pp.187-190 |
| 相關連結 |
機構典藏連結 ( http://tkuir.lib.tku.edu.tw:8080/dspace/handle/987654321/38187 ) |