會議論文
| 學年 | 88 |
|---|---|
| 學期 | 1 |
| 發表日期 | 1999-11-25 |
| 作品名稱 | Micro Pressure Sensor with Sub-mm Size by the Silicon Bulk Micromachining |
| 作品名稱（其他語言） | |
| 著者 | Yang, Lung-Jieh; Chen, Ming-Cheng; Chang, Chin-Jung |
| 作品所屬單位 | 淡江大學機械與機電工程學系 |
| 出版者 | |
| 會議名稱 | 1999年中華民國電子材料與元件研討會 |
| 會議地點 | 桃園縣, 臺灣 |
| 摘要 | This paper proposed a new direction for the miniaturization of silicon bulk-machined sensors. Herein, the glass substrate bonded with the silicon wafer replaces the role of the silicon wafer. Then the whole silicon wafer with sensing portions, whatever piezo-resistive or capacitive types, could be all machined to the membrane structure without chip-area wasting on the {111} surfaces. Basically, the chip size by this semi-SOI method would be as small as the surface-machined one in principle, if the silicon-glass bonding process is guaranteed. The other advantages of this strategy include the process compatibility with the different sensing principles and the different techniques of membrane machining. The on-chip circuitry of sensors could be also preserved. Another important issue is that the surface-machining-like membrane now is mono-crystalline, which means the stable mechanical properties and reproducible characteristics. This new strategy practically augmented the mass production of piezoresistive pressure sensors. The 1.0mm X 0.8mm X 0.5mm of sensor size with chip density exceeds 5,000 per 4-inch wafer was successfully fabricated. |
| 關鍵字 | 微壓力感測器;微加工;矽晶圓;壓電阻率;Micro Pressure Sensor;Micromaching;Silicon Wafer;Piezoresistivity |
| 語言 | |
| 收錄於 | |
| 會議性質 | 國內 |
| 校內研討會地點 | |
| 研討會時間 | 19991125~19991126 |
| 通訊作者 | |
| 國別 | TWN |
| 公開徵稿 | Y |
| 出版型式 | 紙本 |
| 出處 | 1999年中華民國電子材料與元件研討會論文集，頁581-584 |
| 相關連結 |
機構典藏連結 ( http://tkuir.lib.tku.edu.tw:8080/dspace/handle/987654321/96349 ) |