會議論文
| 學年 | 97 |
|---|---|
| 學期 | 2 |
| 發表日期 | 2009-03-15 |
| 作品名稱 | A novel copper bead heat sink for computer cooling |
| 作品名稱（其他語言） | |
| 著者 | Tsai, Meng-Chang; Kang, Shung-Wen; Lin, Chih-Hsien |
| 作品所屬單位 | 淡江大學電機工程學系 |
| 出版者 | New York: Institute of Electrical and Electronics Engineers (IEEE) |
| 會議名稱 | Semiconductor Thermal Measurement and Management Symposium, 2009. SEMI-THERM 2009. 25th Annual IEEE |
| 會議地點 | San Jose, USA |
| 摘要 | The power dissipation of CPU used in desktop computers has been steadily increasing with time. The tendency for a rise in the CPU capacity resulted at present in increasing heat release to 50-100W for desktop PC. The problem of the CPU cooling consists in restricting its temperature to 80-90degC. Current desktop computers use a heat sink of approximately 60 times 80 mm<sup>2</sup> base area. Desktop computers are typically cooled by heat sinks mounted on the CPU. There is also a fan installed to a heat sink forming an assembly that is attached to the CPU. Air is forced through the heat sink by the fan. The fan-heat sink mechanism will be the key component to solve the heat problems. We deliver a novel copper bead heat sink (CBHS), which is a heat sink combines a sinter hollow copper ball to be its fin, to increase the heat exchange surface area with cooling air. By the other way, we made a coaxial rotor on a fan to enhance the heat transfer coefficient of convection. The goal of this plan is to make a new fabrication process, and the new type heat sink can dissipate the heat effectively. Preliminary result showed that the minimum value for the total thermal resistance is 0.48degC/W under 65 W input power. The heater surface temperature is around 51degC. The results of the bead fan are almost the same by clockwise and counterclockwise. The holes on the bottom cannot bring better performance. The wind can't go through those holes into the sink center. Research work is continuing for the heat transfer enhance of CBHS. |
| 關鍵字 | CPU cooler;Copper bead sink;Heat sink;Sinter sink |
| 語言 | en |
| 收錄於 | |
| 會議性質 | 國際 |
| 校內研討會地點 | |
| 研討會時間 | 20090315~20090319 |
| 通訊作者 | |
| 國別 | USA |
| 公開徵稿 | Y |
| 出版型式 | |
| 出處 | Semiconductor Thermal Measurement and Management Symposium, 2009. SEMI-THERM 2009. 25th Annual IEEE, pp.228-231 |
| 相關連結 |
機構典藏連結 ( http://tkuir.lib.tku.edu.tw:8080/dspace/handle/987654321/76566 ) |